http://en.wikipedia.org/wiki/Surface-mount_technology
http://www.fpga4fun.com/external/SMD/smdman.pdf
http://www.youtube.com/watch?v=3NN7UGWYmBY
Is the Process for Soldering, Desoldering Surface Mounted Integrated Circuits (Chips) feasible to implement ?.
Lot of accuracy, precision must be required to desolder the components in terms of correct heat applied ?. There could be chances of the chip pins may getting broken ?. In that case, the Surface mounted component will be of no use. There are also chances of tracks on the board being broken if improper desoldered a SMD ?.
SMD LIMITATIONS
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The real goal of the SMD applications are a maximal packing density and finally volume reduction of the modules and instruments. Exactly this generates for which responsible are not the SMD themselves, but the miniaturization in general.
Point 2. Design of SMD layout is very complex.
Are there any SMD Layout Design Software available ?.
EAGLE PCB DESIGN SOFTWARE
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http://www.cadsoftusa.com/
Thanks & Regards,
Prashant S Akerkar