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guiding_light
http://www.physorg.com/news91286833.html

That"s what this technique sounds like.

Nano Lett., 7 (2), 446 -451, 2007. 10.1021/nl062766o S1530-6984(06)02766-4
Web Release Date: January 26, 2007

Copyright © 2007 American Chemical Society
Electrochemical Nanoimprinting with Solid-State Superionic Stamps

Keng H. Hsu, Peter L. Schultz, Placid M. Ferreira, and Nicholas X. Fang*

Department of Mechanical Science & Engineering, University of Illinois at Urbana-Champaign, Illinois 61801

Received November 27, 2006

Revised January 11, 2007

Abstract:

This letter presents a solid-state electrochemical nanoimprint process for direct patterning of metallic nanostructures. It uses a patterned solid electrolyte or superionic conductor (such as silver sulfide) as a stamp and etches a metallic film by an electrochemical reaction. Our preliminary experiments demonstrate repeatable and high-fidelity pattern transfer with features down to 50 nm on silver films of thicknesses ranging from 50 to 500 nm. As the process is conducted in an ambient environment and does not involve the use of liquids, it displays potential for single-step, high-throughput, large-area manufacturing of metallic nanostructures. The use of superionic conductors in manufacturing opens up a new and potentially energy-efficient approach to nanopatterning and fabrication. It offers a highly competitive approach, both as a stand-alone process and as a complement of other nanofabrication techniques, to fabricating chemical sensors, photonic and plasmonic structures, and electronic interconnects.

guiding_light
One thing came to mind: is this stamp reusable? After all, it soaks up all those metal ions...
Guest
The paper states there is no effect from the silver ion uptake. But the imprint field is really small (300 um in diameter). A larger imprint field may be harder to maintain voltage across.
guiding_light
Maybe it's not the voltage (silver conducts pretty well) but the fact that the ion beam takes too long to mill a larger field.
guiding_light
I just read the paper, it ends by saying "We have successfully patterned copper with similar results and consistency." That would be really revolutionary, I hope they publish it.
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